Foundation for India's first 3D chip unit laid in Bhubaneswar
Union Minister for Electronics & IT Ashwini Vaishnaw and Odisha's Chief Minister Mohan Charan Majhi have laid the foundation of India's first advanced 3D chip packaging unit at Info Valley, Bhubaneswar.
The plan will use 3D glass substrate technology in chip manufacturing, which is a next-generation innovation in the semiconductor sector.
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