Sahasra to set new semiconductor facility, to infuse Rs 350 crore
Sahasra Electronics has planned an investment of Rs 350 crore in the next 3 years to step up a semiconductor packaging facility, under the 'Make in India' program.
As per the firm packaging is a significant facet of semiconductor manufacturing and design, and the wafers' packaging - whether plastic, metal, glass or ceramic - protects them from chemical contamination and damage from light or the impact of heat.
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